New Japan RadioSemiconductor Product Information

INTRODUCTION

Ordering Information >>IC Package Code Table
Quality Assurance System
Recommended Mounting Method (PDF:31K)
Recommended Solder Pads (PDF:305K)
Absolute Maximum Ratings

PACKAGE OUTLINE

Package Systems
Package Line-up
Package Code Table (PDF:91K)
Package Dimensions
Typical Symbols in Package
Standard Mark Layout (PDF:158K)
Thermal Resistance

PACKING

Packing Specification Table
Packing Illustration (PDF:136K)
Plastic Tube Dimensions (PDF:189K)
Taping Dimensions
Tray Dimensions (PDF:281K)


This Page consists of Introduction (Ordering Information, Quality Assurance System, Recommended Mounting Method),Package Outline and Packing Specification of semiconductor products (Bipolar IC, C-MOS IC, Bi-CMOS IC, GaAs MMIC, OPTOELECTRONIC DEVICES). For Recommended Mounting Method, Package Outline and Packing Specification of OPTOELECTRONIC DEVICES, please refer to datasheets.